PENGARUH MAGNET PUTAR, AGITATOR TERHADAP LAJU DEPOSISI ELEKTROPLATING DAN KETEBALAN LAPISAN NIKEL

DAFFA ADITYA AHMAD, . (2025) PENGARUH MAGNET PUTAR, AGITATOR TERHADAP LAJU DEPOSISI ELEKTROPLATING DAN KETEBALAN LAPISAN NIKEL. Sarjana thesis, UNIVERSITAS NEGERI JAKARTA.

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Abstract

Elektroplating nikel pada tembaga merupakan proses pelapisan logam yang banyak digunakan untuk meningkatkan ketahanan korosi dan kekuatan mekanik. Namun, salah satu tantangan dalam proses ini adalah terbentuknya gelembung gas hidrogen di permukaan katoda, yang dapat menghambat distribusi ion nikel dan menurunkan kualitas lapisan. Salah satu metode yang digunakan untuk mengatasi masalah ini adalah pemanfaatan medan magnet eksternal, khususnya medan magnet yang diputar, yang mampu memengaruhi aliran fluida dan membantu pelepasan gelembung gas. Penelitian ini bertujuan untuk menganalisis pengaruh penggunaan magnet putar, agitator terhadap efisiensi proses elektroplating nikel pada tembaga, khususnya dalam hal laju deposisi dan ketebalan lapisan. Penelitian dilakukan melalui eksperimen elektroplating nikel dengan tiga kondisi utama: tanpa agitator, menggunakan magnet putar, dan kombinasi agitator serta magnet putar. Data diperoleh melalui penimbangan sampel sebelum dan sesudah proses elektroplating nikel. Dari hasil penimbangan tersebut maka dapat dihitung laju deposisi dan ketebalan lapisan hasil elektroplating. Hasil penelitian menunjukkan dengan adanya magnet putar akan meningkatkan laju deposisi dan ketebalan lapisan. Sebaliknya dengan adanya agitator mampu mengurangi laju deposisi dan ketebalan lapisan nikel./Nickel electroplating on copper is a metal coating process widely used to enhance corrosion resistance and mechanical strength. However, one of the challenges in this process is the formation of hydrogen gas bubbles on the cathode surface, which can hinder the distribution of nickel ions and reduce the quality of the coating. One method used to address this issue is the utilization of an external magnetic field, particularly a rotating magnetic field, which can influence fluid flow and assist in bubble gas release. This study aims to analyze the effect of using an agitator on the efficiency of the nickel electroplating process on copper, particularly in terms of deposition rate, coating thickness, and hydrogen bubble evolution. The research was conducted through experiments under three main conditions: without an agitator, with a magnet, and with a combination of agitator and magnet. Data were obtained by measuring the deposition rate and coating thickness of the electroplated layer, as well as visually observing the hydrogen bubble release patterns. The results show that the agitator can accelerate the deposition rate and increase the nickel layer thickness by enhancing the distribution of Ni²⁺ ions in the solution. However, excessive agitation leads to turbulence, which reduces deposition efficiency. Additionally, the use of a magnet aids in the release of hydrogen bubbles from the cathode surface. The optimal combination of agitator and magnet provides the best results, although it may cause disturbances if not properly controlled.

Item Type:	Thesis (Sarjana)
Additional Information:	1. Dr. Ferry Budhi Susetyo, M.T., M.Si. ; 2. Dr. Dyah Arum Wulandari, M.T.
Subjects:	Teknologi dan Ilmu Terapan > Manufaktur
Divisions:	FT > D IV Teknologi Rekayasa Manufaktur
Depositing User:	Users 30576 not found.
Date Deposited:	12 Aug 2025 00:57
Last Modified:	12 Aug 2025 00:57
URI:	http://repository.unj.ac.id/id/eprint/59767

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